Hu, Liulin: search on Z-Library

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1

[IEEE 2017 IEEE/MTT-S International Microwave Symposium - IMS 2017 - Honololu, HI, USA (2017.6.4-2017.6.9)] 2017 IEEE MTT-S International Microwave Symposium (IMS) - A 4–10 GHz fully-integrated stacked GaAs pHEMT power amplifier

Wu, Haifeng, Liao, Xuejie, Wang, Cetian, Chen, Yijun, Hua, Yunan, Hu, Liulin, Lv, Jiping, Tong, Wei

Year:

2017

Language:

english

File:

PDF, 365 KB

english, 2017

2

A Broadband Passive Monopulse Comparator MMIC

Chen, Yang, Xu, Yuehang, Hu, Liulin, Tong, Wei, Xu, Ruimin

Journal:

IEEE Microwave and Wireless Components Letters

Year:

2017

Language:

english

File:

PDF, 1.50 MB

english, 2017

3

[IEEE 2016 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) - Chengdu, China (2016.7.20-2016.7.22)] 2016 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) - An S-band dual-channel receiver module based on the technology of TSV

ZhongJun Tang,, ShuWei He,, YiJun Chen,, LiuLin Hu,

Year:

2016

Language:

english

File:

PDF, 6.50 MB

english, 2016

4

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Design, fabrication and characterization of a Q-band patch antenna integrated on stacked interposers

Sun, Yunheng, Jin, Yufeng, Lian, Tingting, Ma, Shenglin, Yang, Yuchi, Wang, Wei, Hu, Liulin, He, Shuwei

Year:

2020

File:

PDF, 550 KB

2020

5

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Design, Fabrication and Characterization of a Novel TSV Interposer Integrated Inductor for RF Applications

Sun, Yunheng, Cai, Han, Li, Jiwei, Ma, Shenglin, Jin, Yufeng, Wang, Wei, Chen, Jing, Miao, Min, Hu, Liulin, He, Shuwei

Year:

2018

Language:

english

File:

PDF, 821 KB

english, 2018

6

[IEEE 2018 International Conference on Microwave and Millimeter Wave Technology (ICMMT) - Chengdu, China (2018.5.7-2018.5.11)] 2018 International Conference on Microwave and Millimeter Wave Technology (ICMMT) - A High-Efficiency 15-Watt GaN HEMT X-Band MMIC Power Amplifier

Wu, Haifeng, Wang, Cetian, Lin, Qian, Chen, Yijun, Hu, Liulin, Tong, Wei

Year:

2018

Language:

english

File:

PDF, 374 KB

english, 2018

7

[IEEE 2019 Cross Strait Quad-Regional Radio Science and Wireless Technology Conference (CSQRWC) - Taiyuan, China (2019.7.18-2019.7.21)] 2019 Cross Strait Quad-Regional Radio Science and Wireless Technology Conference (CSQRWC) - An Ultra-Broadband Quadruple-Stacked CMOS Power Amplifier

Lin, Qian, Wu, Haifeng, Zhang, Xiao-Ming, Hu, Liulin, Chen, Si-Wei, Hu, Dan-Hui

Year:

2019

Language:

english

File:

PDF, 332 KB

english, 2019

8

[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Design, Fabrication and Test of Dual Redundant TSV Interconnection for Millimeter Wave Applications

Wang, MengCheng, Ma, Shenglin, Cai, Han, Hu, Liulin, He, ShuWei

Year:

2019

File:

PDF, 2.61 MB

2019

9

A 6–18 GHz broadband power amplifier MMIC with excellent efficiency

Chen, Yifeng, Quan, Jinhai, Liu, Yungang, Hu, Liulin

Journal:

Journal of Semiconductors

Year:

2014

Language:

english

File:

PDF, 145 KB

english, 2014

10

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Study of 3D SiP (system-in-package) module for package-on-package application using multi-layer PCB manufacturing process

Hu, Liulin, Jin, Zhu, Liao, Xuejie, Ouyang, Yaoguo, Dong, Jinsheng

Year:

2014

Language:

english

File:

PDF, 904 KB

english, 2014

11

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Design, Fabrication and Characterization of a Novel TSV Interposer Integrated Inductor for RF Applications

Sun, Yunheng, Cai, Han, Li, Jiwei, Ma, Shenglin, Jin, Yufeng, Wang, Wei, Chen, Jing, Miao, Min, Hu, Liulin, He, Shuwei

Year:

2018

File:

PDF, 821 KB

2018

12

[IEEE 2018 International Conference on Microwave and Millimeter Wave Technology (ICMMT) - Chengdu, China (2018.5.7-2018.5.11)] 2018 International Conference on Microwave and Millimeter Wave Technology (ICMMT) - A High-Efficiency 3-Watt GaAs pHEMT X-Band MMIC Power Amplifier

Hua, Yunan, Wu, Haifeng, Liao, Xuejie, Liao, Chengjv, Hu, Liulin, Lv, Jiping

Year:

2018

File:

PDF, 356 KB

2018

13

[IEEE 2020 IEEE/MTT-S International Microwave Symposium (IMS) - Los Angeles, CA, USA (2020.8.4-2020.8.6)] 2020 IEEE/MTT-S International Microwave Symposium (IMS) - A Compact Ultra-broadband GaN MMIC T/R Front-End Module

Lin, Qian, Wu, Haifeng, Chen, Yijun, Hu, Liulin, Chen, Shanji, Zhang, Xiaoming

Year:

2020

File:

PDF, 965 KB

2020

14

A Wheat WRKY Transcription Factor TaWRKY10 Confers Tolerance to Multiple Abiotic Stresses in Transgenic Tobacco

Wang, Chen, Deng, Pengyi, Chen, Liulin, Wang, Xiatian, Ma, Hui, Hu, Wei, Yao, Ningcong, Feng, Ying, Chai, Ruihong, Yang, Guangxiao, He, Guangyuan, Zhang, Xiaoyu

Journal:

Year:

2013

Language:

english

File:

PDF, 9.05 MB

english, 2013

15

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Thermal and Electrical Characterization of TSV Interposer Embedded with Microchannel for 2.5D Integration of GaN RF Devices

Cai, Han, Ma, Shenglin, Wang, Wei, Jin, Yufeng, Chen, Jing, Zhang, Jian, Xiang, Weiwei, Hu, Liulin, He, Shuwei

Year:

2018

Language:

english

File:

PDF, 1.11 MB

english, 2018

16

Design, fabrication, and RF property evaluation of a TGV interposer for 2.5D RF integration

Cai, Han, Yan, Jun, Ma, Shenglin, Luo, RongFeng, Xia, Yanming, Li, Jiwei, Hu, Liulin, He, Shuwei, Tang, Zhongjun, Jin, Yufeng, Wang, Wei, Chen, Jing

Journal:

Journal of Micromechanics and Microengineering

Year:

2019

Language:

english

File:

PDF, 1.54 MB

english, 2019

17

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Design, Fabrication and Characterization of TSV Interposer Integrated 3D Capacitor for SIP Applications

Li, Jiwei, Ma, Shenglin, Liu, Huan, Guan, Yong, Chen, Jing, Jin, Yufeng, Wang, Wei, Hu, Liulin, He, Shuwei

Year:

2018

Language:

english

File:

PDF, 559 KB

english, 2018

18

[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Design and Experimentally Verification of a Vertical Coaxial Transmission Structure in High resistivity Si Interposer

Wang, MengCheng, Ma, Shenglin, He, ShuWei, Hu, Liulin, Wang, Wei, Jin, Yufeng

Year:

2020

File:

PDF, 1.79 MB

2020

19

High Intake of Energy and Fat in Southwest Chinese Women with PCOS: A Population-Based Case-Control Study

Zhang, Jing, Liu, Ying, Liu, Xiaofang, Xu, Liangzhi, Zhou, Lingling, Tang, Liulin, Zhuang, Jing, Guo, Wenqi, Hu, Rong, Yu, Yang

Journal:

Year:

2015

Language:

english

File:

PDF, 175 KB

english, 2015

20

[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Thermal resistance analysis for a high power 3D integrated RF Module based on TSV interposer

Hu, Xinxin, Zhou, Bin, Ma, Shenglin, Gong, Dan, Wang, Mengcheng, Jin, Yufeng, Wang, Wei, Chen, Jing, He, Shuwei, Hu, Liulin

Year:

2019

Language:

english

File:

PDF, 1.25 MB

english, 2019

21

[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - Study of 3D SiP (system-in-package) module for package-on-package application using multi-layer PCB manufacturing process

Hu, Liulin, Jin, Zhu, Liao, Xuejie, Ouyang, Yaoguo, Dong, Jinsheng

Year:

2014

Language:

english

File:

PDF, 904 KB

english, 2014

22

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Thermal and Electrical Characterization of TSV Interposer Embedded with Microchannel for 2.5D Integration of GaN RF Devices

Cai, Han, Ma, Shenglin, Wang, Wei, Jin, Yufeng, Chen, Jing, Zhang, Jian, Xiang, Weiwei, Hu, Liulin, He, Shuwei

Year:

2018

File:

PDF, 1.11 MB

2018

23

[IEEE 2019 IEEE/MTT-S International Microwave Symposium - IMS 2019 - Boston, MA, USA (2019.6.2-2019.6.7)] 2019 IEEE MTT-S International Microwave Symposium (IMS) - A 2 to 18 GHz Compact High-Gain and High-Power GaN Amplifier

Wu, Haifeng, Lin, Qian, Zhu, Lin, Chen, Shanji, Chen, Yijun, Hu, Liulin

Year:

2019

Language:

english

File:

PDF, 871 KB

english, 2019

24

[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Thermal Property Evaluation of TSV interposer Embedded Microfluidics for Cooling 2.5D Integrated High Power IC Device

Ma, Shenglin, Lian, Tingting, Cai, Han, Hu, Liulin, He, Shuwei

Year:

2019

File:

PDF, 3.01 MB

2019

25

[IEEE 2018 International Conference on Microwave and Millimeter Wave Technology (ICMMT) - Chengdu, China (2018.5.7-2018.5.11)] 2018 International Conference on Microwave and Millimeter Wave Technology (ICMMT) - Design and Process Technology for High Q Integrated Inductor on Interposer with TSV

Hu, LiuLin, He, ShuWei, Sun, Yunheng, Ma, Shenglin

Year:

2018

File:

PDF, 7 KB

2018

26

Fluorescence imaging mitochondrial copper(II) via photocontrollable fluorogenic probe in live cells

Wang, Liulin, Chen, Buxiang, Peng, Pingping, Hu, Wenbo, Liu, Zhipeng, Pei, Xiaohua, Zhao, Weihong, Zhang, Chengwu, Li, Lin, Huang, Wei

Journal:

Chinese Chemical Letters

Year:

2017

Language:

english

File:

PDF, 769 KB

english, 2017

27

Synthesis and liquid crystallinity of dendronized carbohydrate liquid crystal

Liulin Yang, Yanming Dong, Xiaolan Hu, Anhua Liu

Journal:

Carbohydrate Research

Year:

2012

Language:

english

File:

PDF, 1.27 MB

english, 2012

28

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Design, Fabrication and Characterization of TSV Interposer Integrated 3D Capacitor for SIP Applications

Li, Jiwei, Ma, Shenglin, Liu, Huan, Guan, Yong, Chen, Jing, Jin, Yufeng, Wang, Wei, Hu, Liulin, He, Shuwei

Year:

2018

File:

PDF, 559 KB

2018

29

[IEEE 2019 International Conference on Microwave and Millimeter Wave Technology (ICMMT) - Guangzhou, China (2019.5.19-2019.5.22)] 2019 International Conference on Microwave and Millimeter Wave Technology (ICMMT) - A Ka band multifunction MMIC

Chen, Yijun, Tong, Wei, Lv, Jiping, Hu, Liulin, Su, Li

Year:

2019

Language:

english

File:

PDF, 511 KB

english, 2019

30

[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Design, fabrication and measurement of TSV interposer integrated X-band microstrip filter

Sun, Yunheng, Jin, Yufeng, Cai, Han, Ma, Shenglin, Hu, Liulin, He, Shuwei

Year:

2019

File:

PDF, 2.65 MB

2019

31

Hybrid Rhodamine Fluorophores in the Visible-NIR Region for Biological Imaging

Wang, Liulin, Du, Wei, Hu, Zhangjun, Uvdal, Kajsa, Li, Lin, Huang, Wei

Journal:

Angewandte Chemie International Edition

Year:

2019

Language:

english

File:

PDF, 2.54 MB

english, 2019

32

Design, fabrication, and RF property evaluation of a TGV interposer for 2.5D RF integration

Cai, Han, Yan, Jun, Ma, Shenglin, Luo, RongFeng, Xia, Yanming, Li, Jiwei, Hu, Liulin, He, Shuwei, Tang, Zhongjun, Jin, Yufeng, Wang, Wei, Chen, Jing

Journal:

Journal of Micromechanics and Microengineering

Year:

2019

File:

PDF, 1.54 MB

2019

33

[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Design, Fabrication and Measurement of Micro-Bumps Array for RF Application

Yang, Yuchi, Chen, Jing, Wang, Wei, Wang, Mengcheng, Ma, Shenglin, Hu, Liulin, He, Shuwei

Year:

2020

File:

PDF, 1.26 MB

2020

34

[IEEE 2018 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA) - Beijing, China (2018.11.21-2018.11.23)] 2018 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA) - A 2.5D integrated L band Receiver based on High resistivity Si interposer

Ma, Shenglin, Chai, Yuan, Yan, Jun, Cai, Han, Hu, Liulin, He, Shuwei, Wang, Wei, Chen, Jing, Jin, Yufeng

Year:

2018

File:

PDF, 440 KB

2018

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